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Foundry Service Offerings
Bulk CMOS
Flexibility and reliability all from one chip
Realize your vision of mixed-technology SoC solutions with Bulk CMOS platforms
The flexibility and reliability your design needs – all from one chip. Easily integrated with a range of devices and features, including high-voltage, embedded memory and RF, Bulk CMOS technology from GF is time-proven to provide the flexibility and integrated features required by your design. Built as a modular architecture, Bulk CMOS technology is built to ensure that GF’s foundation IP and your custom designed modules are compatible across an entire platform.
BCD & BCDLite®
Flexible platforms for efficient power management
Minimize charging time and deliver all day device usage to your customers with the BCD platforms from GF. Equipped with embedded memory options and automotive qualifications, the platforms offer power management solutions for a range of market applications, including automotive, smart mobile devices and IoT. High-performance and ultra-efficient, the BCD platforms provide performance and low power.
FDX™ FD-SOI
Combining high‑performance and ultra‑low power
Purpose-built for connected intelligence at the edge
You’ve already envisioned a high-performing, low-power design for your product. Now it’s time to make it a reality. GF’s FDX platform offers full SoC integration including digital, analog and high performance RF for signal range. The 22FDX® platform offers a versatile SoC when you can’t compromise between ultra-low power and performance.
FinFET 12LP+
Reliable performance for demanding applications
Get the unique features you want with the high-performance you need with 12nm FinFET platforms from GF
You demand the best performance because you know that innovation never stands still. GF’s FinFET process technology is purpose-built for high-performance SoCs in demanding, high-volume applications for the automotive, consumer and industrial markets. Equipped with features for radio frequency, automotive qualification and low-power memory & logic, GF’s FinFET platform includes the advanced features you need without sacrificing the performance required by your design.
RF SOI
Boost RF performance, signal power and reliability
Launch your products into the wireless future with RF SOI technology from GF
Your customers expect lightning-fast downloads and reliable connectivity anytime and anywhere. Deliver these expectations with the RF SOI technology that’s found in most smartphones on the market. GF collaborates with top RF design companies to provide industry-leading RF SOI technologies that are optimized to deliver low power, low noise and low latency for various radio frequency applications, while also delivering longer battery life and high signal quality.
SiGe
Reliable technology for high‑power functionality
All the signal power and performance you’ve imagined, achieved through SiGe by GF
The reliable, high-power signal functionality you need for your design, all on one chip. With more than four billion SiGe-based chips shipped, GF has the experience to help you build designs to achieve the speed, bandwidth and digital functionality your devices need. When you want to bring your innovations to life – reliably and powerfully – trust GF.
Gallium Nitride (GaN)
Introducing GF’s gallium nitride (GaN) solutions
As silicon and CMOS technologies approach their performance limits, novel materials such as gallium nitride (GaN) unlock the potential to deliver more efficient power supplies and meet demanding high-performance radio frequency (RF) and millimeter-wave (mmWave) applications.
By harnessing GaN’s wide bandgap advantages, high electron mobility and low capacitance, GF’s GaN solutions deliver cutting-edge performance, integration and thermal management to empower next-generation consumer and industrial RF and power applications.
Silicon Photonics
GF proven silicon photonics technology helps you innovate your designs for success at the speed and bandwidth your customers expect. With our electro-optical process design kit (PDK) and SCALE™ optical module solution, or Silicon Photonics Co-packaged Advanced Light Engine solution, for co-packaged optics (CPO), GF enables high-reliability, energy-efficient fiber-optic connectivity to meet data center requirements as architectures evolve.
You can count on our technical support team for excellent supply chain management and product delivery efficiency, with your products are launched into the market at a competitive price with high efficiency.
ams-OSRAM Technology
We aspire to be your foundry of choice for mixed-signal designs using industry-standard processes – 110nm, 180nm and 350nm analog and mixed signal CMOS, High-Voltage CMOS and BICMOS plus specialty process options like RF, low-noise, high-voltage and BCD. As all base processes are compatible with major semiconductor manufacturers, alternative sourcing can be accommodated with minimal effort.